CHROME PLATING

Chrome Plating

Gold plating is often used in electronics, to provide a corrosion-resistant electrically conductive layer on copper, typically in electrical connectors and printed circuit boards. With direct gold-on-copper plating, the copper atoms tend to diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide and/or sulphide layer.

A layer of a suitable barrier metal, usually nickel, is often deposited on the copper substrate before the gold plating. The layer of nickel provides mechanical backing for the gold layer, improving its wear resistance. It also reduces the impact of pores present in the gold layer. Both the nickel and gold layers can be plated by electrolytic or electroless processes. There are many factors to consider in selection of either electrolytic or electroless plating methods. These include what the deposit will be used for, configuration of the part, materials compatibility and cost of processing. In different applications, electrolytic or electroless plating can have cost advantages.

CHROME PLATING PROCESS FLOW CHART

Kerosene Cleaning Remove of oil & grease
Sawdust Cleaning Remove of kerosene
Degresing G & W Chemical 80gm/l
Rinse Hot Water Stationary water
Rinse Cold Water Stationary water
Etching Chemical Etching Chemical
Rinse Running water
Bright Dip Bright Dip chemical
Rinse Stationary water
Chromatizing Yellow/green/white
Rinse Stationary water
Drying Oven
Curing Open air
Inspection Ok to Despatch